Evolution of surface morphology in TiNiCu shape memory thin films

Yong Qing Fu, Sohrab Sanjabi, Zoe Barber, Bill Clyne, Wei Min Huang, M. Cai, Jikui Luo, Andrew Flewitt, William Milne

Research output: Contribution to journalArticlepeer-review

27 Citations (Scopus)


A transition of filmsurface morphology between wrinkling and surface relief during heating/cooling is reported for a sputtered TiNiCu thin filmshape memoryalloy. The mechanisms for this transition are discussed based on film stress evolution. During annealingsurface wrinkling occurs to relieve compressive stress in the film, while the surface relief morphology occurs during cooling due to the martensitic transformation, which relieves tensile stress.
Original languageEnglish
Pages (from-to)171922
JournalApplied Physics Letters
Issue number17
Publication statusPublished - 2006


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