Stress induced texture and shape memory trench in TiNiCu films

Y. Q. Fu, W. M. Huang, H. J. Du

Research output: Contribution to journalArticlepeer-review

3 Citations (Scopus)


Film texture and surface morphology of a crystallized TiNiCu film (deposited at 350 °C and post annealed at 450 °C in vacuum on a four inch wafer) have been characterized. X-ray diffraction analysis showed a preferred (002) martensite orientation at room temperature and a strong (110) austenite texture at temperature above 80 °C. Surface trenches were observed on the crystallized film surface at room temperature and disappeared when the film was heated to a high temperature above 80 °C. The formation of the strong texture and shape memory trenches is attributed to a significant stress evolution during post-annealing process. The variation of the trench morphology on the surface of the TiNiCu film surface over a four inch wafer after annealing has also been studied.

Original languageEnglish
Pages (from-to)5290-5296
Number of pages7
JournalThin Solid Films
Issue number15
Publication statusPublished - 31 May 2011
Externally publishedYes


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